PIC Awards is produced by Angel Business Communications - the organisers of PIC International Conference and PIC International Magazine. The awards ceremony will take place at PIC International Conference on the 26th March 2019, Brussels, Belgium.
To recognise and highlight key industry achievements in advancing photonic integration through platform development, manufacturing, design, packaging and device characterisation, PIC International magazine is proud to host its 3rd PIC Awards programme.
With nominations and voting taking place online and presentations made at the PIC International 2019 networking dinner on the evening of March 26th in Brussels, the awards put the spotlight on innovation.
The awards programme is dedicated to celebrating leading lights in the industry.
This category celebrates the efforts of foundry service providers, fabless companies, equipment manufacturers, and packaging and test centers enabling the future production of Photonic Integrated Circuits, PIC-enabled products, enabling innovative applications to the field on photonic integration.
This award recognizes advances in the development and application of key materials systems driving today’s photonic integrated circuits and providing a stepping stone to future devices.
This category celebrates the efforts by companies bringing PICs in applications where PICs are connected to fiber optics, such as in transceivers-modules, tunable lasers, high speed photodiodes.
This category celebrated the efforts by companies bringing to PICs to different markets, where the PIC is not connected to a single or array of optical fibers, this could be in applications such as sensing, consumer electronics, environmental monitoring, AR/VR, medical.
Individual contributor to pics and pic technologies either academic, industrial, commercial, or governmental, either by demonstrated results, designs, publications, prototypes, product, patents, policies, etc.
The name of this category is self-explanatory. Previous winners: Meint Smit (2017), Roel Baets (2018).
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