Voting terms and conditions
  • You can make only one vote per award category.
  • Votes will only be accepted from a current business email address.
  • Votes from third party email providers (hotmail, yahoo, etc) will NOT be counted.
  • A nominated company or supplier cannot vote for themselves or their nominee, any such votes will NOT be counted.
  • All voting closes on 23 March 2018.
  • Voters will be expected to provide their title, first name, last name, job title, email address and company name. The information is for vote validation purposes.
  • Any obvious voting abuses may result in nominee withdrawal.
PIC Platforms

This award recognises advances in the development and application of key materials systems driving today’s photonic integrated circuits and providing a stepping stone to future devices.

Company Awards GCS

Founded in 1997, as a California Corporation, Global Communication Semiconductors, LLC ("GCS") is an ISO-certified premier pure-play compound (III-V) semiconductor (GaAs, InP and GaN ) wafer foundry service provider that manufactures technology leading, high performance, high quality, semiconductor devices. Portfolio offerings include Radio Frequency Integrated Circuits (RFIC) and millimeter wave integrated circuits for the wireless markets, power devices for power electronics, and Photodetectors and Lasers for optical communications markets.GCS offers foundry services for RF/Wireless, Power Electronics and Optoelectronics in addition to GCS designed proprietary optical wafers and chips (“GCS Known Good Die”™).

Company Awards Ligentec

LiGenTec SA is a company located at EPFL innovation park in Switzerland and an expert in offering silicon nitride thickness above 600nm maintaining very low waveguide propagation loss.The main application areas include integrated quantum photonics, high Q-filters, supercontinuum generation, pulse generation, spectroscopy, bio-sensing and microwave photonics.With its silicon nitride chips LIGENTEC enables products based on integrated photonics for fabless companies and research institutions to be able to work with silicon nitride.

Company Awards Oclaro

Oclaro is one of the largest providers of lasers and optical components, modules and subsystems for the optical communications, industrial, and consumer laser markets. Oclaro has pushed Photonic Integration technologies as key enablers for many components and modules. As an example, Oclaro’s integrated modulator chip for the coherent CFP2 includes four parallel Mach-Zehnder modulators, various splitters and recombiners, amplifiers (SOAs), a full suite of inline and dump port detectors for set up and control, and spot size converters on all optical ports to facilitate packaging.

Company Awards Lumentum

Lumentum is a market-leading manufacturer of innovative photonic products enabling optical networking and laser customers. In March 2016, Lumentum unveiled a new optical whitebox platform supporting an ecosystem enabling SDN within data center and metro/edge DWDM transport. The initial products include a family of configurable rack-mountable optical whiteboxes: terminal amplifier, line amplifier, mux/demux, and ROADM. In August 2016, Infinera and Lumentum announced that they had been successfully testing the compatibility of Lumentum’s whitebox platform with the PIC based products of Infinera. The tests included the successful transmission of PIC-based superchannels and multiple modulation formats.

Company Awards IBM

IBM Research established a technology facilitating large channel count and broadband fiber-to-chip optical interfacing for silicon photonics. The silicon photonics chip is flip-chip attached to a polymer waveguide array structure where the individual polymer waveguides exhibit a core size similar to that of single-mode fibers. By tapering the silicon waveguide width and a close proximity of the silicon taper and the polymer waveguide core, the optical signal is transferred from the silicon to the polymer and is then coupled to a fiber through a standard butt-coupling technique. We established a single mode polymer waveguide processing technology, the silicon chip to polymer waveguide flip-chip attach process and a single mode fiber to polymer waveguide assembly technology. Low loss optical coupling between the silicon chip and the polymer waveguides of below 1.5 dB was achieved for both polarization states and for a very large wavelength window from 1270 nm to 1570 nm. A 1 dB lateral alignment tolerance of +/- 2 um was obtained and simultaneous attach of up to 94 optical interfaces was demonstrated. A polymer waveguide to fiber coupling loss of 0.5 dB was achieved experimentally. The broadband and polarization tolerant nature of the realized technology in combination with its scalability to a large number of channels opens up new opportunities for large bandwidth and high-density optical connectivity to silicon photonic chips. The large wavelength window enables optical links employing wavelength division multiplexing, which is important for future data center networks. The large optical channel count provides a route to systems with increased number of inputs and outputs, which is for example of high interest for switching systems. As the silicon photonics chip is conventionally flip-chip attached to the polymer waveguide structure, the assembly layout is compatible with electrical silicon first-level packaging supporting BGA interconnects. Consequently, this technology is an important building block for enabling large bandwidth silicon photonics devices to be co-packaged with processors and switch chips.

Company Awards Cisco

With a wide range of optical transport offerings, Cisco is uniquely positioned to help carriers scale bandwidth while lowering costs and increasing service velocity through multilayer convergence. Cisco has a category-leading optical transport portfolio, including colorless and omnidirectional reconfigurable optical add/drop multiplexers (ROADM), the industry's most complete IP over DWDM solution, and next-generation technologies like 100 Gigabit.

Advances in PIC Manufacturing

Evolution in PIC production is helping to bring a new generation of devices into the market. This category celebrates the success stories so far.

Company Awards VLC Photonics

VLC Photonics has been, from its foundation as a spin-off, a pioneer in the new business model of a photonic design house. Being a leading company in the field, it has grown over the years to provide many more services, has partnered with many software provides, foundries and packagers to mature their platforms, and has helped hundreds of customers in developing their own PICs, with some of them reaching the market through start-ups and Fortune 500 corporations. Overall, I believe without doubt that it has significantly helped the whole photonic integration field to advance in the last decade.

Company Awards Physik Instrumente

PI (Physik Instrumente) with headquarters in Karlsruhe, Germany, in the past four decades has become the leading manufacturer of nanopositioning systems with accuracies in the nanometer range.. All key technologies are developed in-house. This allows the company to control every step of the process, from design right down to shipment: precision mechanics and electronics as well as position sensors.The required piezoceramic elements are manufactured by its subsidiary PI Ceramic in Lederhose, Germany, one of the global leaders for piezo actuator and sensor products.PI miCos GmbH in Eschbach near Freiburg, Germany, is a specialist for positioning systems for ultrahigh vacuum applications as well as parallel-kinematic positioning systems with six degrees of freedom and custom-made designs.

Company Awards ficonTEC

ficonTEC is a premier supplier of semi- and fully-automated optical device assembly and testing systems for the optical industry, including HPLD manufacturing, fiber-optics and opto-electronics, medical technology, security and military applications, RD, telecommunications, and others. In PIC, ficonTEC has revolutionized the automation of packaging with the FL300 fiber optic AutoAlign system. ficonTEC's automation solutions are based on its expertise in process technology and systems engineering where each solution is appropriately customized from a proven line of system platforms. Hence, they serve they serve the PIC market with standard and individual machines by a dedicated and extremely experienced team.

Company Awards LioniX International

LioniX International has been established in April 2016, and has acquired LioniX, Satrax, XiO Photonics and OctroliX B.V. The focus of LioniX International is on PIC enabled modules based on its proprietary waveguide technology (TriPleX™), in addition to microfluidics, optofluidics and MEMS. The acquisition of the aforementioned companies creates a vertical integrated company that delivers a complete solutions: from initial design through volume manufacturing of products. In addition, LioniX International has entered into strategic collaborations with partners in South Korea, to provide high-volume manufacturing of chips and assemblies, thereby enabling a seamless transition from prototype to high-volume manufacturing.

Company Awards Luxtera

Luxtera, Inc., is a leader in Silicon Photonics. It is the first company to overcome the complex technical obstacles involved with integrating high performance optics directly with silicon electronics on a mainstream CMOS chip, bringing direct “fiber to the chip” connectivity to market. Headquartered in Carlsbad, California, Luxtera is a fabless semiconductor company that was founded in 2001 by a team of industry-renowned researchers and technology managers drawn from the communications and semiconductor industries. Luxtera has received funding from leading venture capitalists including August Capital, New Enterprise Associates, Sevin Rosen Funds and Lux Capital.

Company Awards Intel

Intel has always been at the forefront of this exciting new technology, announcing the world’s first hybrid silicon laser nearly a decade ago. But what truly makes our role in silicon photonics unique is not only our efficient, high-volume silicon manufacturing, but our dedication to furthering research in this field. Investing in silicon photonics enables future data center bandwidth to grow, driving evolution of form factors, speed (100G today, 400G tomorrow), and optical integration platforms.

Company Awards Neophotonics

NeoPhotonics is a leading designer and manufacturer of hybrid photonic integrated optoelectronic modules and subsystems for bandwidth-intensive, high-speed communications networks. The company's products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks.

Company Awards Juniper

Through our passion for creating high-performing networks, Juniper extends knowledge, collaboration, and human advancement in industries around the world—such as energy, healthcare, education, and many others.While our innovative product and services portfolio evolves continuously, we need to reach farther to secure our customers’ long-term success. We’re looking beyond the horizons of today’s business challenges, and the technology future we see is built on real-time service integration. That means everything we develop must align with our vision.Our customers’ innovations and groundbreaking solutions are everywhere. Look closely when you see them, and you’ll discover the power of Juniper at every turn.We build more than networks. We help our customers build the amazing.

Company Awards Infinera

Infinera is raising the bar for optical performance with the industry’s highest spectral efficiency in a commercially shipping product. Featuring up to 50% more capacity than conventional systems without advanced coherent technologies such as Nyquist subcarriers and SD-FEC gain sharing

Company Awards IQE

IQE is the leading global supplier of innovative, advanced semiconductor wafer products covering a diverse range of applications. The group offers the industry’s broadest product portfolio, with a choice of technology platforms from global manufacturing facilities spanning Europe, Asia and the USA. Technology leadership lies at the heart of our strategy and we are playing a leading role in developing a wide range of next generation enabling materials. We have established a world leading position in vertical cavity surface emitting laser (VCSEL) technology that is set to revolutionise the world of photonics for applications ranging from ultra-high-speed optical fibre communications through to laser based pico-projectors.

Advances in Photonics Integration

This award recognises innovative approaches to new and commercially important PIC technology platforms, PIC packing, PIC design that results in more features into a chip and raising the bar to the next level.

Company Awards VPIphotonics GmbH

VPIphotonics performed pioneering work with their tools supporting the layout-aware schematic-driven design methodology. This concept enables a smooth photonic and optoelectronic circuit design workflow starting with a logical idea and allowing designers to gradually elaborate its layout, easily incorporating requirements such as adequate layout connectivity, packaging, and functional specifications. In close collaboration with other software vendors and partnering foundries, VPI developed integrated design solutions allowing to combine graphical schematic capture, including automated parameter sweeps and optimization even for parameters that affect the circuit layout, and automated waveguide routing of PICs utilizing a single or a combination of different technology platforms.The layout-aware schematic-driven design methodology allows circuit simulation and layout design tasks to be performed simultaneously, using the same schematic capture environment. For this, a circuit-level simulator is seamlessly integrated with a layout design tool, providing designers transparent access to the capabilities of both software packages. In particular, it becomes possible to directly specify in the circuit-level simulator physical locations and orientations of PDK building blocks (BBs) on the final layout. Also, the library of PDK BBs is extended with a set of elastic waveguide connectors (the same as provided by the underlying layout design tool), allowing sub-circuits having fixed locations to be easily interconnected without the need to manually solve complex geometrical problems. The circuit simulator automatically, and invisibly for users, invokes the layout design tool to determine the actual physical lengths and shapes of all elastic connectors, constructs compact simulation models for them, and after that initiates the circuit simulations. Foundry-specific PDK extensions for the VPIcomponentMaker Photonic Circuits simulator (VPItoolkit PDK fab) implement the novel layout-aware schematic-driven PIC design methodology, for instance, supporting Multi-Process Waver runs at the open access foundries available through JePPIX. In terms of this methodology, VPIcomponentMaker Photonic Circuits supports the capability to specify exact physical locations and orientations of PDK BBs on the final layout, as it might be required by design-rule-check (DRC) and packaging specifications, and to connect sub-circuits having fixed locations by smart elastic optical connectors. This allows to combine graphical schematic capture and automated waveguide routing, which are currently considered separately and represent a major problem for PIC designers. Key enabler for this functionality is the seamless integration of circuit and layout tools: VPIcomponentMaker Photonic Circuits extended by any of the VPItoolkit PDK fab automatically and invisibly for users invokes a layout design tool (OptoDesigner by PhoeniX Software or IPKISS by Luceda Photonics) to determine the actual physical lengths and shapes of all elastic connectors, constructs compact simulation models for them, and after that initiates the circuit simulations. Intermediate and final circuit design solutions can be exported automatically to OptoDesigner or IPKISS to fit the layout to the die package, add proper electrical wire routing, perform DRC verification, and generate a GDS mask for circuit fabrication. The foundry-specific building blocks supported by a VPItoolkit PDK fab can be used alongside with a broad set of standard modules and instrumentation in VPIcomponentMaker Photonic Circuits. These libraries include passive and active components with thoroughly tested and extensively documented physical models, optical and electrical signal sources, as well as open interfaces for experimentally measured or numerically calculated device models. Furthermore, flexible design and modeling capabilities are offered, including a unique hybrid time-and-frequency-domain modeling (TFDM) approach for large-scale active photonic integrated circuits, support of hierarchical designs including parametric characterization, and APIs for cosimulation with Python, Matlab and C++. References: [1] S. Mingaleev, A. Richter, E. Sokolov, S. Savitzki, A. Polatynski, J. Farina, I. Koltchanov, "Rapid virtual prototyping of complex photonic integrated circuits using layout-aware schematic-driven design methodology", Proc. SPIE 10107 -- Smart Photonic and Optoelectronic Integrated Circuits XIX, 1010708, (2017). [2] A. Richter, S. Mingaleev, and I. Koltchanov, "PIC Design: Schematic Or Layout First? Both!", PIC Magazine, Issue 4 (March 2017). design innovations.

Company Awards LioniX International

LioniX International is a leading global provider of customized microsystem solutions, in particular integrated photonics-based, in scalable production volumes.We provide customized solutions for OEM’s and System Integrators, from design to fully assembled modules, by vertical integration in scalable production volumes. We maintain our technology leadership secured by a strong IP position.LioniX International focuses on Photonic Integrated Circuits (PIC) enabled modules based on its proprietary waveguide technology (TriPleX™), in addition to its other core competences micro-fluidics, opto-fluidics and MEMS. As a vertical integrated company we deliver a complete solution to our OEM customers: from initial design through volume manufacturing of products.Our PIC modules and additional competences can be used in a suite of applications in Telecom/Datacom, Life Science, Metrology and is offered as well in our technology services.

Company Awards VLC Photonics

VLC Photonics is a reliable partner, totally committed to your particular technical and business needs, human in the deal, and pioneer in the market development of application-specific photonic integrated circuits.Our mission is to provide engineering solutions that allow our customers to harness the benefits of photonic integration, as well as to build up on our providers technologies. Our mission spans from the initial work of drafting high-level optical system architectures to the final part of specifying its deepest technical details, all the while under a customized approach to the specific application domain at hand.

Company Awards FP7 PhoxTroT Consortium

The research project PhoxTroT, ” Photonics for High-Performance, Low-Cost Low-Energy Data Centers, High Performance Computing Systems: Terabit/s Optical Interconnect Technologies for On-Board, Board-to-Board, Rack-to-Rack data links”, funded by the European Commission under 7th Framework Programme (FP7) – ‘ICT-2011.3.5 – Core and disruptive photonic technologies’, completed successfully its activities delivering the revolutionary optical interconnect solutions towards High-Performance, Low-Cost Low-Energy Data Centers, High Performance Computing Systems exploiting existing photonic technologies in a holistic way, synergizing the different fabrication platforms in order to deploy the optimal “mixmatch” technology and tailor this to each interconnect layer.

Company Awards IHP

IHP performs RD in the fields of silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication. The focus of research at the institute is oriented towards issues relevant for business, resulting in applications for telecommunications, semiconductor and automotive industries, aerospace, telemedicine, and automation technologies. The institute has developed into a competence center for silicon-germanium technologies. In recent years, IHP is dedicating considerable efforts to photonic frontend integration with its high-performance BiCMOS technology. The objective is to provide high-performing BiCMOS electronics co-integrated with photonics building blocks such as SOI-waveguides, Germanium photo-detectors, and modulators to academic and industrial users.

Company Awards Sicoya

Sicoya a spin off from TU Berlin, is developing silicon photonics based PICs for optical data center interconnects using a fabless business model. Sicoya aims to enter the market with a 4x25 Gbit/s sealed and packaged transceiver chip for intra data center connections with link distances up to 2 km. Sicoya designs, packages and sells silicon photonic based Application Specific Photonic Integrated Circuits (ASPICs). Sicoya’s technology enables the production of highly integrated optical transceivers at very low manufacturing costs. Extremely small integrated form factors lead to practical and cost efficient scaling roadmaps for Terabit per second data rates.

Company Awards Multiphoton Optics

Multiphoton Optics’ High-Precision 3D Printing Technology raises the bar in photonics integration, as this technology allows an easy integration of various PIC platforms (Silicon Photonics, TriPlex, Indium Phosphide) by just passive alignment. Interconnects and coupling structures can be fabricated on-chip, chip-to-chip, chip-to-board, etc. The High Precision 3D Printer Platform allows an extremely high degree of freedom in processes, material choices, and fabrication strategies (machine- and exposure driven) providing a tremendous throughput in prototyping and production phases. Surface parameters can be adjusted by choice, with roughness values beginning below 5 nm. Different tasks can be simply executed in one packaging process: optical interconnects can be fabricated next to in-/outcoupling structures such as arbitrarily microoptical elements. The latter can be also used to create a master (Ni shim, polymer mold) to even more upscale the production process for imaging, illumination, and other fields where photonics packaging is required. There are no restrictions in sample formats and kind of substrate – highly flexible processes with the LithoProf3D® High-Precision 3D Printer Platform for Photonics Packaging of the next generation at industrial throughput with no restriction on the PIC and die platforms, reduced cost, and less consumption of resources.

Company Awards Ayar Labs

Our mission is to cut the amount of energy used in computing in half, by removing bottlenecks in moving data. We help companies keep up with skyrocketing volumes of data by miniaturizing fiber optic transceivers and making them in standard silicon chips, replacing copper interconnects and bringing the super-high bandwidths and low energy use of optical communications inside computers.

PIC Hero

A company or entity advancing the state-of-the-art for commercially important PIC performance - it could be integration of electronics with photonics, large scale integration, 100, 400, 800G performance for high speed, super low power, super functionality, super small size and miniaturization etc

Company Awards Christian Koos, KIT

Christian Koos is a professor at Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ) since 2010. He received the Dipl.-Ing. (M.Tech.) and the Dr.-Ing. degree in Electrical Engineering from the University of Karlsruhe, in 2002 and 2007, respectively. From 2007 to 2008, he carried out post-doctoral research at the Institute of Photonics and Quantum Electronics, University of Karlsruhe, where he pioneered nanophotonic silicon-organic hybrid (SOH) devices. From 2008 to 2010, he was leading the technology radars "Nanotools and Nanometrology" and “Metrology” within the Corporate Research and Technology department of Carl Zeiss AG, Germany.

Company Awards BRIGHT Photonics & NAZCA

BRIGHT Photonics is the first commercial PIC design house and behind the first commercial modules for technology transparent design of PIC components like AWGs and interconnects. In 2017 BRIGHT launched “NAZCA Design”. A state-of-the art free and open source PIC design tool for mask layout and more. It highly stimulates open access and open innovation for commercial and research projects. NAZCA turns out to be a game changer. The photonics community is adopting it rapidly as the tool of preference for its quality, efficiency and flexibility. While sharing PIC design for free with the community, the core business of BRIGHT Photonics remains quality driven commercial product development support for PIC based applications.

PIC Technologist

Experts in translating PIC technologies towards commercial reality and product qualification including filing IP/patents and publications through papers and talks.

Individual Awards Peter O’ Brien

Dr. Peter O'Brien is Principle Investigator for photonics packaging research at the Tyndall National Institute. The team develops innovative packaging solutions for a wide range of integrated photonic components and they interact with a large number of academic researchers and industrial partners. During his academic career he worked as a research scientist at NASA’s Jet Propulsion Laboratory (Micro Devices Laboratory) and the California Institute of Technology in Pasadena. In these positions he was responsible for development of TeraHertz semiconductor devices for remote sensing applications. Dr. O’Brien previously founded a start-up company, Epi-Light Limited, producing highly-specialised LED-based optical systems for biotech and pharmaceutical imaging applications. He has also worked as a technical consultant for a number of international biotech and pharmaceutical companies. In these roles, he applied his knowledge of photonics and optics to determine solutions for manufacturing and diagnostic related problems. Dr O’Brien also worked for a number of years for a US multinational (General Instrument, Power Semiconductor Division), where he was responsible for manufacture of a range of Silicon IC devices. Dr. O’Brien has a PhD in Physics and Masters in Engineering from University College Cork and a degree in Physics from Trinity College Dublin. He has also been a visiting researcher at University of California at Santa Barbara, University of Marburg (Germany) and Ecole Nationale Supérieure d'Electronique et de Radioélectricité de Grenoble (France).

Individual Awards Bill Ring

Bill Ring is currently a Senior VP at Poet Technologies where his work encompasses both III-V devices and dielectric technology. The major focus of the Dielectric waveguide development is currently on the introduction of Poet’s Optical Interposer Platform utilizing a low loss dielectric waveguide that is deposited and compatible with current CMOS processes. Previously, Bill was CEO of BB Photonics Inc., a start up developing uncooled 100GbE receivers using InP PICs with embedded dielectric waveguides. This was sold to Poet Technologies in June 2016. From 2010 to 2014, Bill was involved in the due diligence and purchase of Solar Systems Pty Ltd, an Australia concentrated photovoltaic company, where he subsequently held the roles of GM and then Chief Technology Officer for the company. Prior to this, he had started a consulting company in 2005 that worked with several fortune 500 companies and many start-up companies in the areas of defense, optoelectronic components and datacenter optical devices. During this period he also managed workshops for the USA based Optoelectronic Industry Development Association (OIDA) from 2005 to 2009. Before 2005 Bill held positions at Tyco Electronics, as Director of Operations and Director of development for devices and transceivers. Before joining Tyco, he was a Principle Engineer at Hewlett Packard (HP) and responsible for the design and development of 1310nm FP, 1480nm pump and DFB lasers for HP’s fiber optics group. In 1995 he introduced the first strained MQW laser into production at HP's UK facility that was later deployed in HP’s 1300nm SFF/SFP transceivers. Bill Holds a PhD from Surrey University in III-V light emitting devices, which showed that Intervalence Band Absorption (IVBA) was not the dominant loss mechanism in long wavelength lasers.

PIC Entrepreneur and Business Leader

Leader for PIC based technologies and driving new frontiers with start-up companies or internal technological programs within large corporations.

Individual Awards Fang Wu

Fang Wu (CTO) has 30 years of experience in the photonics industry across multiple technology disciplines. For the last 17 years, her interest has been focused on InP-based Photonics Integrated Circuits (PICs) for Access, Datacom and Telecom applications. She received her B.S in Electronic Engineering from Shanghai Jiaotong University and her Ph.D. from Liverpool University in 1985 and 2000, respectively. She co-founded ArtIC Photonic in 2013 and as Chief Technology Officer has led the development and productization of highly integrated high-speed PICs for high capacity transceivers, including coherent receivers suitable for 32Gbaud to 64Gbaud transmission systems, and uncooled EMLs with up to 50GHz bandwidth and very low modulation voltage suitable for Datacenter applications. She has more than 50 papers published and holds 7 US patents. ArtIC Photonics is a privately held company, headquartered in Ottawa, Canada, which designs and produces Indium Phosphide (InP) based photonic integrated circuits (PICs). ArtIC Photonics' proprietary integration platform integrates all active/passive device functions on to a common passive optical waveguide structure which is used for both intra-PIC routing and external connections. Because our integration building blocks can be deployed without modification, even when many functions are combined, PIC designs can be based on established library device models that are derived from building block verification data. This approach facilitates a foundry-based development and production model for photonics, which is standard in the electronic industry. ArtIC Photonics’ high-performance PIC enabled transmitter and receiver products enhance the performance and reduce the cost of both current and next generation optical networks.

Individual Awards Bill Ring

Bill Ring is currently a Senior VP at Poet Technologies where his work encompasses both III-V devices and dielectric technology. The major focus of the Dielectric waveguide development is currently on the introduction of Poet’s Optical Interposer Platform utilizing a low loss dielectric waveguide that is deposited and compatible with current CMOS processes. Previously, Bill was CEO of BB Photonics Inc., a start up developing uncooled 100GbE receivers using InP PICs with embedded dielectric waveguides. This was sold to Poet Technologies in June 2016. From 2010 to 2014, Bill was involved in the due diligence and purchase of Solar Systems Pty Ltd, an Australia concentrated photovoltaic company, where he subsequently held the roles of GM and then Chief Technology Officer for the company. Prior to this, he had started a consulting company in 2005 that worked with several fortune 500 companies and many start-up companies in the areas of defense, optoelectronic components and datacenter optical devices. During this period he also managed workshops for the USA based Optoelectronic Industry Development Association (OIDA) from 2005 to 2009. Before 2005 Bill held positions at Tyco Electronics, as Director of Operations and Director of development for devices and transceivers. Before joining Tyco, he was a Principle Engineer at Hewlett Packard (HP) and responsible for the design and development of 1310nm FP, 1480nm pump and DFB lasers for HP’s fiber optics group. In 1995 he introduced the first strained MQW laser into production at HP's UK facility that was later deployed in HP’s 1300nm SFF/SFP transceivers. Bill Holds a PhD from Surrey University in III-V light emitting devices, which showed that Intervalence Band Absorption (IVBA) was not the dominant loss mechanism in long wavelength lasers.

Individual Awards Pascual Munoz / Jose Capmany

Pascual Munoz was born in Valencia, Spain on February 7th, 1975. He received the Ingeniero de Telecomunicación degree from Universitat Politècnica de València (UPV) in 1998 and the Ph.D. degree in photonics from UPV in 2003. Since 2017, he is Full Professor, Photonic Integrated Circuits, at the Photonic Research Labs, UPV. Prof. Muñoz runs a consolidated research line, started in 2005, on prototyping Photonic Integrated Circuits (PICs) in a technology agnostic fashion, where PICs are designed in the best suited technology (Silicon-On-Insulator, Indium Phosphide, Silica on Silicon, Silicon Nitride amongst other) for each application. He has been involved in several European Commission funded projects, being coordinator for integration on InP within the NoE IST-EPIXNET. He has published 50 papers in international refereed journals and over 70 conference contributions. He is a member of the Technical Programme Committees of the European Conference on Optical Communications (ECOC) and the European Conference on Integrated Optics (ECIO). Prof. Muñoz received the VPI Speed Up Photonics Award in 2002 for innovative Fourier optics AWG with multimode interference (MMI) couplers modeling, by Virtual Photonics Incorporated and IEEE Communications Magazine. He was also granted the IEEE/LEOS Graduate Student Fellowship Program in 2002. He received the extraordinary doctorate prize from UPV in 2006. Prof. Muñoz is a Senior Member of IEEE, Senior Member of the OSA and Member of SPIE. From his research line, he co-founded the UPV spin-off company VLC Photonics in 2011, where the PIC design know-how, expertise and tools were transferred, and he served as CEO from 2011 to 2013. His main achievements as lead entrepreneur and CEO where to establish VLC as a world-reputed brand in PICs, to gather the seed technical and sales team, as well as to secure the first two rounds of investment. Since 2011 he is a member of the Board of Directors (BoD), where the company strategy is set for the management, and a member of the Joint VLC-UPVLC RD Commission, where topics for mutual collaborative and/or contractual research are defined and supervised. From the BoD, and since 2011, he has directly contributed to the evolution of VLC from a small design house start-up to a world reputed fabless photonic integration company. José Capmany was born in Madrid, Spain, on December 15 1962. He received the Ingeniero de Telecomunicacion degree from the Universidad Politécnica de Madrid (UPM) in 1987 and the Licenciado en Ciencias Físicas in 2009. He holds a PhD in Electrical Engineering from UPM and a PhD in Quantum Physics from the Universidad de Vigo. Since 1991 he is with the Departamento de Comunicaciones, Universidad Politecnica de Valencia (UPV), where he started the activities on optical communications and photonics, founding the Optical Communications Group ( He has been an Associate Professor from 1992 to 1996, and Full Professor in optical communications, systems, and networks since 1996. In parallel, he has been Telecommunications Engineering Faculty Vice-Dean from 1991 to 1996, and Deputy Head of the Communications Department since 1996. Since 2002, he is the Director of the ITEAM Research Institute, Universidad Politécnica de Valencia. His research activities and interests cover a wide range of subjects related to optical communications including optical signal processing, ring resonators, fiber gratings, RF filters, SCM, WDM, and CDMA transmission, wavelength conversion, optical bistability and more recently quantum cryptography and quantum information processing using photonics. He has published over 450 papers in international refereed journals and conferences and has been a member of the Technical Programme Committees of the European Conference on Optical Communications (ECOC), the Optical Fiber Conference (OFC), the Integrated Optics and Optical Communications Conference (IOOC), CLEO Europe, and the Optoelectronics and Communications Conference (OECC). Professor Capmany has also carried out activities related to professional bodies. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the Optical Society of America (OSA) and the Institution of Electrical Engineers (IEE). He has acted as a reviewer for over 25 SCI journals in the field of photonics and telecommunications. Professor Capmany is the recipient of King James I award on novel technologies 2012, the highest scientific distinction in Spain. He has also received other wards including the Extraordinary Doctorate Prize of the Universidad Politécnica de Madrid in 1992. He is an associate Editor of IEEE Photonics Technology Letters and is a Member of the Editorial Board of Fiber and Integrated Optics, Microwave and Optical Technology Letters. He has also been a Guest Editor for the IEEE Journal of Selected Topics in Quantum Electronics.

Individual Awards Hans van den Vlekkert

Hans van den Vlekkert (President CEO) has been active in the MST for over 30 years. He has carried out research, as well as development work resulting in many products available on the market such as pH-ISFET systems and accelerometers. During his career, he has been responsible for marketing and sales (CSEM and TMP) as well as for production of Microsystems (Sentron, CSEM and TMP as head of silicon foundries and subcontracting higher volumes to other foundries and assembly companies. He has also been responsible for the Mesa+ Nanolab.He was active in European programs as project leader for large projects such as Europractice and was also member of the board of Nexus and Eurimus. At present, amongst others, he is member of the board of IVAM and Project Coordinator of the large Memphis project ( 30 MEuro’s research program on photonics in the Netherlands). He has written over 50 papers and holds several patents in various fields.

Individual Awards Tim Jenks

Timothy S. Jenks has served as President and Chief Executive Officer of Neo Photonics and as a member of the board of directors since April 1998. From November 2002 until August 2005, Mr. Jenks also served as Chief Executive Officer of NanoGram Corporation, a nanomaterials applications company that we spun out, and that was acquired by Teijin Corporation. From November 2002 until March 2003, Mr. Jenks served as Chief Executive Officer and director of NanoGram Devices Corporation, a medical device battery company that we spun out and that was acquired by Greatbatch, Inc. Mr. Jenks served in positions of increasing responsibility at Raychem Corporation, a California-based materials engineering company that was acquired by Tyco International Ltd. (now TE Connectivity Ltd.) in 1998, including Vice President and General Manager of its electrical products division. Mr. Jenks is a former naval officer, and holds a master of business administration degree from the Stanford Graduate School of Business, a Master of Science degree in nuclear engineering from the Massachusetts Institute of Technology and a Bachelor of Science degree in mechanical engineering and marine engineering from the U.S. Naval Academy.

Individual Awards Dr Michael Lebby

Dr. Michael S. Lebby has been the Chief Executive Officer of Lightwave Logic, Inc. since May 1, 2017. Dr. Lebby serves as an Advisor at Redfern Integrated Optics, Inc. Dr. Lebby served as the Chief Technology Officer and General Manager of Translucent at Silex Systems Ltd. Dr. Lebby Founded Ignis Optics, Inc. since 2001 and served as its President and Chief Executive Officer. He served as the President and Chief Executive Officer of Optoelectronics Industry Development Association (OIDA)., since 2006. He has more than 20 years of experience in the field of optical communications. In 1985, he joined ATT Bell Laboratories. He joined Motorola's Phoenix Corporate Research Laboratory, where he served as its RD Business Technology Development Manager in 1997. Dr. Lebby served as Head of Translucent at Silex Systems Ltd. From 1990 to 1998, he served as an RD section head of Motorola's OPTOBUS program. He was a member of ATT Bell Labs and British Ministry of Defense Photonic research efforts, where he concentrated on InP and GaAs OEIC's. After a year at AMP as a member of the Global Optoelectronics Division's management team, Dr. Lebby joined Intel Capital as a Corporate Investor. His career has spanned all aspects of the optoelectronics business, ranging from research and development, to sales, marketing and investing. Dr. Lebby is internationally recognized as a technologist, leader and market expert in optics and photonics. Dr. Lebby's reputation in the field of optoelectronics is widely recognized with wide-ranging experience across many key areas including: Intel Capital Optoelectronics team, ATT Bell Labs and Motorola photonics research, Oclaro as well as an Entrepreneur with his own venture backed fiber optics start-ups. He headed the Optoelectronics Industry Development Association (OIDA), the premier networking trade association for business and scientific professionals in the optical space based in Washington, DC. Dr. Lebby has testified on behalf of the optoelectronics industry on Capitol Hill and brought the industry together on key issues. In 2015, Dr. Lebby completed a set of industry roadmaps for integrated photonics technologies over the next decade as part of the Federally funded IMI (Institute of Manufacturing Innovation) competition. With over 200 USPTO issued utility patents (and over 395 including national and international derivatives), Dr. Lebby is considered to be one of the most prolific inventors in the field of optoelectronics. He is also a Fellow and member of the Institute of Electrical and Electronics Engineers (IEEE) and the Optical Society of America (OSA). He has been Executive Director of OIDA since 2005. He serves as Director of Optoelectronics Industry Development Association. He serves as an Independent Director of IntexyS Photonics SA. He serves as Member of Technical Advisory Board at Translucent Inc. He served as Director of Intel. He served as Director of AMP/Tyco. He served as Director of Redfern Integrated Optics, Inc., since June 6, 2007. He has been an Director of Lightwave Logic, Inc. since May 1, 2017 and served as its Independent Director August 26, 2015 until April 1, 2017. Dr. Lebby holds more than 200 US patents in optoelectronics. He is a Fellow member of IEEE and OSA. Dr. Lebby was awarded the degree of Doctor of Engineering in 2004 as well as PhD in 1987 and an MBA in 1985 from the University of Bradford in the United Kingdom.

Individual Awards Radha Nagarajan

In the last 18 years, Radha Nagarajan has successfully designed, developed and managed multiple generations of photonic integrated circuit products in both the InP and Si platforms. He has more than 25 years of experience in high-speed optical components and photonic integration. Since June 2013 he is the Chief Technology Officer, Optical Interconnect, of the Inphi Corp., where he leads the development and commercialization of Silicon Photonics based 100Gbit/s, PAM4, QSFP-28, DWDM modules for datacenter interconnects up to 120km reach. These modules have been deployed in the field, carrying live traffic, since 2017. At full capacity, the aggregate system bandwidth per fiber is 4Tbit/s. Prior to joining Inphi, he was with Infinera, as a Fellow, working on the design, development and commercialization of large-scale InP based photonic integrated circuits. He lead the development of 3 generations of InP PIC’s (two generations for direct detect and one for coherent systems) all which have been successfully deployed in the field. Coherent InP PIC’s also had on-chip integrated low linewidth DFB lasers for local oscillators. From 1995 until 2001, he was with SDL/JDS Uniphase, where he worked on the development of high performance 980nm pump modules and multi-gigabit fiber optic transmitters and receivers, at Fibre Channel, Gigabit Ethernet and SONET OC48 data rates. Dr. Nagarajan is a Fellow of the IEEE (for contributions to high-bandwidth semiconductor laser and photonic integrated circuit technologies), OSA (for the design, development and commercialization of high-speed, high-power semiconductor lasers and large-scale photonic integrated circuits) and IET. In 2006, he was awarded the IEEE/LEOS Aron Kressel Award for his work on commercializing large-scale photonic integrated circuits. He has authored four book chapters, and the fifth is due for publication this year. He has also published more than 185 technical papers in the areas of high-speed optical components and photonic integration. He has been awarded 128 US patents mostly for his inventions in photonic integrated circuits. He received his B.Eng. (First Class Hons) from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the University of California, Santa Barbara. The degrees were all in Electrical Engineering.

Lifetime PIC Achievement

Pioneers in photonic integration that have helped make PICs a reality and their knowledge and expertise underpins major advances in the industry. This award recognises outstanding service to the sector.

Individual Awards Professor Roel Baets

Roel Baets (Professor) received an MSc degree in Electrical Engineering from Ghent University in 1980 and a second MSc degree from Stanford University in 1981. He received a PhD degree from Ghent University in 1984. From 1984 till 1989 he held a postdoctoral position at IMEC (with detachment to Ghent University). Since 1989 he has been a professor in the Faculty of Engineering and Architecture at UGent where he founded the Photonics Research Group. Roel Baets has made contributions to research on photonic integrated circuits, both in III-V semiconductors and in silicon. In 2006 he founded ePIXfab, the first Multi-Project-Wafer service for silicon photonics. Since then ePIXfab has evolved to be the European Silicon Photonics Alliance. He leads the Photonics Research Group at Ghent University. Roel Baets is also director of the multidisciplinary Center for Nano- and Biophotonics (NB Photonics) at UGent, founded in 2010. He was co-founder of the interuniversity UGent-VUB MSc programme in Photonics and of the European MSc programme in Photonics. Roel Baets is a grant holder of the Methusalem programme of the Flemish government and of the European Research Council (ERC advanced grant). He is a Fellow of the IEEE, of the European Optical Society (EOS) and of the Optical Society of America (OSA) He is also a member of the Royal Flemish Academy of Belgium.

Individual Awards Ronan Burgess

Individual Awards Andy Carter

Individual Awards Fred Kish

Dr. Fred Kish has been a key figure in pioneering the development and commercialization of large-scale InP photonic integrated circuits (PICs). He was one of the first employees at Infinera Corporation (2001), founded with the vision of utilizing photonic integration to build new optical communications networking gear and architectures. At Infinera, as Vice President of PIC Research, Development and Manufacturing, he led that team that developed the first practical (commercial) optical system-on-chip (SOC), consisting of first commercial 100 Gb/s transmitters and receivers (10 x 10Gb/s) integrating over 60 functions onto a pair of InP-based chips in 2004. At Infinera, Kish has led efforts to commercial four generations of PICs, including the most recent offering of 1.2 Tb/s transmitter and receiver PICs (6 x 200 Gb/s) . Network gear utilizing these system-on-chip PICs has generated $5B in revenue to date and has resulted in Infinera Corporation being amongst the market share leaders in the North America and worldwide long-haul DWDM market. Dr. Kish is co-author of 80 U.S. Patents and 100 peer-reviewed publications on PIC technology. Some of the firsts pioneered by Dr. Kish and his team include the first commercially deployed devices to: (i) operate at 100Gb/s, (ii) to integrate fully functional single AND multiple WDM (wavelength division multiplexing) channels on a PIC, (iii) to utilize InP-based arrayed-waveguide gratings (AWGs), and (iv) to utilize arrays of tunable lasers. In the field of coherent transmission, Dr. Kish and team developed the first research demonstration AND commercialization of a monolithically integrated transmitter / receiver where all functions required for the QPSK transmission are integrated onto a single pair of chips. Furthermore, these chips scale this groundbreaking innovation to integrate 10 of these fully functional channels onto a single pair of transmit and receive chips, integrating a total of 600 functions. Most recently, the Infinera team led by Dr. Kish developed the first commercial devices to integrated widely (full C-Band) tunable lasers with a fully integrated coherent transmitter and receiver, the first multi-channel PICs integrating widely tunable lasers, and the first multi-channel PICs operating at 33 Gbaud, 16-QAM. In collaboration with other leaders in the industry, Kish lobbied and made multiple proposals to help catalyze a national U.S. institute for photonic integrated circuit technology and manufacturing. These efforts were successful and resulted in the formation of a photonic integrated circuit institute for manufacturing innovation formed in 2015 (AIM Photonics), with a funding of $500M over 5 years. Infinera is a founding member of the institute and Dr. Kish is a member of the Leadership Council of the institute. The PIC technology and products developed by Dr. Kish and team have helped shaped the field of photonic integration and have greatly influenced the landscape of the optical networking industry. Dr. Kish as a member of the U.S. National Academy of Engineering and is also a Fellow of the Optical Society of America (OSA) and the Institute of Electrical and Electronics Engineers (IEEE). He has received numerous awards from the IEEE and OSA in recognition of his work.

Individual Awards John E. Bowers

Professor John Bowers is a renowned scientist, inventor, educator, entrepreneur, and mentor in optoelectronics and photonic integration. In his early research stage, he made significant contribution to the understanding of dynamics in high-speed diode lasers and photodetectors. More recently his pioneering works in inventing hybrid/heterogeneous lasers and integration platform on silicon, developing ultra-low-loss waveguides, and demonstrating reliable monolithic III-V quantum dot lasers on silicon tremendously fuels the acceleration of technical advance and commercialization of integrated Si photonics. He is a recipient of the Tyndall award and the IEEE Photonics award and truly embodies the essence of this Lifetime PIC Achievement Award.

Our Supporters and Sponsors

With branding and sponsorship opportunities, align your company with the PIC Awards to reach the PIC Industry - find out more

stay up to date

Stay up to date with all the latest developments for the PIC Awards 2018